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3D-CAM SLl 7870 Polycarbonate-like Resin

RenShape® SL 7870 stereolithography material is a water clear, low viscosity stable liquid that produces high clarity models and prototypes with good surface finish and detail. The SL 7870 prototypes also exhibit good dimensional stability even in a humid atmosphere. Parts made from SL 7870 deliver high impact resistance while retaining durability over time.


Appearance Clear liquid
Density @ 25°C (77°F) 1.13 g/cm3
Viscosity @ 28°C (82°F) 210 cps
Viscosity @ 30°C (86°F) 180 cps
Penetration depth (Dp) 7.2 mils
Critical exposure (Ec) 10.6 mJ/cm2
Part building layer thickness* 0.10mm (0.004 in.)

Post-Cured Material

UV post-cure
90-minute UV + 2 hours

@ 80°C (176°F) thermal postcure
Hardness, Shore D ASTM D-2240 86 87
Flexural modulus ASTM D-790 1,980-2,310 MPa
(286-333 ksi)
2,010-2,350 MPa
(289-338 ksi)
Flexural strength ASTM D-790 65-71 MPa
(9,400-10,300 psi)
65-74 MPa
(9,400-11,000 psi)
Tensile modulus ASTM D-638 1,930-2,020 MPa
(278-291 ksi)
1,860-2,030 MPa
(268-292 ksi)
Tensile strength ASTM D-638 38-42 MPa
(5,470-6,050 psi)
39-42 MPa
(5,620-6,050 psi)
Elongation at break ASTM D-638 10-22% 10-23%
Impact strength, notched Izod ASTM D-256 45-61 J/m
(0.85-1.15 ft.-lb./in.)
43-60 J/m
(0.81-1.13 ft.-lb./in.)
Heat deflection temperature ASTM D-648
@ 66 psi
@ 264 psi
48°C (118°F)
41°C (106°F)
49°C (120°F)
43°C (109°F)
Glass transition, Tg DMA, E peak 56°C (133°F) 57°C (135°F)
Coefficient of thermal expansion TMA (T<Tg) TMA (T>Tg) 97 x 10-6/°C
216 x 10-6/°C
87 x 10-6/°C
213 x 10-6/°C
Cured Density 1.15g/cm3